Light-emitting device

ABSTRACT

A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application of and claims thepriority benefit of U.S. application Ser. No. 13/975,391, filed on Aug.26, 2013, now allowed. The prior U.S. application Ser. No. 13/975,391claims the priority benefit of Taiwan application serial no. 102118649,filed on May 27, 2013. The entirety of each of the above-mentionedpatent applications is hereby incorporated by reference herein and madea part of this specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention generally relates to a light-emitting device, and moreparticularly, to a light-emitting device with better heat-dissipatingeffect.

2. Description of Related Art

With the evolution of photoelectrical technology, the light-emittingmechanism of light-emitting elements is also evolved from thethermoluminescence to the electroluminescence (EL). In order to resultin different light colors, the EL-based light-emitting element adoptsphosphors to convert the wavelength of the light emitted from thelight-emitting element and it has become a common approach.

In terms of light-emitting diode lamps (LED lamps), in order to achievedifferent light color, a wavelength conversion cover is normallydisposed over an LED light source module. When the light emitted fromthe LED light source module irradiates the wavelength conversion cover,a white light conversion starts. However, both the thermal energyproduced by the LED light source module and the thermal energy producedduring white light conversion would be accumulated on the wavelengthconversion cover to rise the temperature of the wavelength conversioncover. Since the wavelength conversion cover is made of phosphors andpolymer material or glass, and the phosphors under a high temperaturewould produce phenomenon of thermal quenching of luminescence, thefluorescent conversion effect of the wavelength conversion cover isdegraded to further produce color shift phenomenon.

SUMMARY OF THE INVENTION

Accordingly, the invention is directed to a light-emitting device,wherein the heat-conducting structure thereof directly contacts awavelength transferring cover to quickly expel the heat produced by alight-emitting element of the light-emitting device so as to effectivelyreduce the thermal quenching phenomenon of luminescence.

A light-emitting device includes a base; a wavelength convertingstructure, comprising: a heat-conducting structure comprising aplurality of accommodating spaces; and a wavelength converting materialfilled in the accommodating spaces; and at least one light-emittingelement disposed on the base, wherein the base is connected to theheat-conducting structure, and the wavelength converting structurecovers the light-emitting element.

A light-emitting device includes a base having at least onelight-emitting element mounted thereon; a heat-conducting meshed frameconnected to the base; and a plurality of wavelength converting blocksembedded in meshes of the heat-conducting meshed frame, the wavelengthconverting blocks and the heat-conducting meshed frame covering thelight-emitting element.

A light-emitting device includes a base having at least onelight-emitting element mounted thereon; a wavelength converting layer;and a light-transmissive and heat-conducting body connected to the base,wherein the wavelength converting layer is carried and covered by theheat-conducting body, and the wavelength converting layer and theheat-conducting body cover the light-emitting element.

A light-emitting device includes a light emitting base; a wavelengthconverting material covering the light emitting base; and a reflectiveand heat-conducting body connecting the light emitting base and thewavelength converting material, and the reflective and heat-conductingbody being light-transmissive.

Based on the description above, since the heat-conducting structure ofthe invention is disposed on the base and directly contacts thewavelength transferring cover, the heat-conducting structure can quicklyexpel the heat produced by a light-emitting element via the base andavoid the heat produced by the light-emitting element from concentratingon the wavelength transferring cover so as to effectively reduce thethermal quenching phenomenon of luminescence of the wavelengthtransferring cover. In short, the light-emitting device of the inventionhas better heat-dissipating effect and can effectively avoid producingthe thermal quenching phenomenon of luminescence.

Other objectives, features and advantages of the present invention willbe further understood from the further technological features disclosedby the embodiments of the present invention wherein there are shown anddescribed preferred embodiments of this invention, simply by way ofillustration of modes best suited to carry out the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the disclosure, and are incorporated in and constitutea part of this specification. The drawings illustrate embodiments of thedisclosure and, together with the description, serve to explain theprinciples of the invention.

FIG. 1A is a partial three-dimensional cross-sectional view of alight-emitting device according to an embodiment of the invention.

FIG. 1B is a partial three-dimensional cross-sectional view of alight-emitting device according to another embodiment of the invention.

FIG. 2 is a partial three-dimensional cross-sectional view of alight-emitting device according to yet another embodiment of theinvention.

FIG. 3A is a partial three-dimensional cross-sectional view of alight-emitting device according to yet another embodiment of theinvention.

FIG. 3B is a partial three-dimensional cross-sectional view of alight-emitting device according to yet another embodiment of theinvention.

FIG. 3C is a partial three-dimensional cross-sectional view of alight-emitting device according to yet another embodiment of theinvention.

FIG. 4 is a partial three-dimensional cross-sectional view of alight-emitting device according to yet another embodiment of theinvention.

FIG. 5 is a partial three-dimensional cross-sectional view of alight-emitting device according to yet another embodiment of theinvention.

FIG. 6 is a partial three-dimensional cross-sectional view of alight-emitting device according to yet another embodiment of theinvention.

DESCRIPTION OF THE EMBODIMENTS

FIG. 1A is a partial three-dimensional cross-sectional view of alight-emitting device according to an embodiment of the invention.Referring to FIG. 1A, in the embodiment, a light-emitting device 100 aincludes a base 110, at least one light-emitting element 120 (only oneis shown in FIG. 1A), a wavelength transferring cover 130 a and aheat-conducting structure 140 a. In more details, the light-emittingelement 120 is disposed on the base 110 and electrically connected tothe base 110. The wavelength transferring cover 130 a is disposed on thebase 110 and covers the light-emitting element 120. The heat-conductingstructure 140 a is disposed on the base 110 and directly contacts thewavelength transferring cover 130 a.

Specifically, the light-emitting element 120 in the embodiment is, forexample, a light-emitting diode (LED) for producing light. Thewavelength transferring cover 130 a has an inner surface 132 a and anouter surface 134 a opposite to each other, in which the heat-conductingstructure 140 a directly contacts the inner surface 132 a of thewavelength transferring cover 130 a. As shown by FIG. 1A, theheat-conducting structure 140 a in the embodiment is, for example, amesh heat-conducting structure, in which the mesh pattern of the meshheat-conducting structure is, for example, rectangular shape, which theinvention is not limited to. Perfectly, the heat-conducting structure140 a in the embodiment preferably occupies 5-40% of the surface area ofthe inner surface 132 a of the wavelength transferring cover 130 a. Ifthe ratio is less than 5%, the heat-conducting effect would not be good,while if the ratio is greater than 40%, it may cause light-shading toaffect the light emitting efficiency. In particular, the ratio of themaximal vertical distance D between a top point 135 a on the wavelengthtransferring cover 130 a and the base 110 over the height H1 of theheat-conducting structure 140 a ranges between 0.9 to 2. The height H1of the heat-conducting structure 140 a should be specified according tothe real demand to get better heat-conducting effect without affectinglight emitting. The material of the heat-conducting structure 140 a isselected from materials with high heat-conducting effect and highreflectivity, such as at least one of silver, gold, copper, platinum,tin and aluminium, or selected from materials with better thermalconductivity such as carbon nanotube or grapheme. In this way, inaddition to quickly expelling the heat produced by the light-emittingelement 120 via the base 110 to avoid the heat from concentrating orstaying on the wavelength transferring cover 130 a, the heat-conductingstructure 140 a can increase the light emitting effect of thelight-emitting element 120 through the structure design and the materialselection, which further advances the light emitting efficiency of thelight-emitting device 100 a.

FIG. 1B is a partial three-dimensional cross-sectional view of alight-emitting device according to another embodiment of the invention.Referring to FIG. 1B, the light-emitting device 100 a′ in the embodimentis similar to the light-emitting device 100 a of FIG. 1A except that thelight-emitting device 100 a′ in the embodiment further includes aheat-dissipating base 112, in which the base 110 is disposed on theheat-dissipating base 112. By means of layout of the heat-dissipatingbase 112 and the heat-conducting structure 140 a, the heat-conductingstructure 140 a is able to quickly expel the heat produced by thelight-emitting element 120 outwards or to the other externalheat-conducting parts such as cooling fins (not shown) via theheat-dissipating base 112. The material of the heat-dissipating base 112is, preferably, selected from at least one of aluminium, tin, copper,silver, gold and ceramic, which can effectively increase theheat-dissipating efficiency of the light-emitting device 100 a′. Inparticular, since the heat-dissipating base 112 has a height so that thelight-emitting element 120 disposed on the base 110 can be elevated soas to expand the light emitting angle (i.e., the full circumferentialangle).

It should be noted that the embodiment does not limit the relativedisposition between the heat-conducting structure 140 a and thewavelength transferring cover 130 a. In other embodiments, referring toFIG. 2, a wavelength transferring cover 130 a′ in the embodiment iscomposed of, for example, an arc top-cover 131 a and a side-wall 133 a,in which the side-wall 133 a is connected between the arc top-cover 131a and the base 110, and the side-wall 133 a is upright at the base 110and surrounds the light-emitting element 120. The heat-conductingstructure 140 b of the light-emitting device 100 b is, for example, amesh heat-conducting structure, which is, for example, a meshheat-conducting structure with a rectangular mesh pattern and the meshheat-conducting structure is disposed on the inner surface 132 a of thewavelength transferring cover 130 a′ and located on the side-wall 133 aonly. In other words, the height H2 of the heat-conducting structure 140b is less than the maximal vertical distance D between the top point 135a of the wavelength transferring cover 130 a′ and the base 110. Theratio of the maximal vertical distance D and the height H2 herein is,preferably, 2, i.e., the height of the heat-conducting structure 140 bis a half of the maximal vertical distance D between the top point 135 aof the wavelength transferring cover 130 a′ and the base 110 only sothat the heat-conducting effect and the design avoiding light-shadingreaches the optimum balance.

The embodiment nevertheless does not limit the shape of the wavelengthtransferring cover 130 a′. In fact, in addition to the bullet shapecontaining the arc top-cover 131 a and the side-wall 133 a as shown inFIG. 2, the wavelength transferring cover can be, for example, as thesemi-sphere shape like the wavelength transferring cover 130 b 1 in thelight-emitting device 100 b 1 of FIG. 3A, or the sphere shape like thewavelength transferring cover 130 b 2 in the light-emitting device 100 b2 of FIG. 3B, or the roughly sphere shape with a narrow neck portionlike the wavelength transferring cover 130 b 3 in the light-emittingdevice 100 b 3 of FIG. 3C, which the invention is not limited to and canbe decided according to the real demand.

The heat-conducting structure 140 c of the light-emitting device 100 ccan be also, as shown by FIG. 4, for example, a mesh heat-conductingstructure, which has a mesh pattern of quasi triangle shape and isdisposed on the outer surface 134 a of the wavelength transferring cover130 a, in which the mesh pattern of triangle shape can effectivelyreduce light-shading. The heat-conducting structure 140 a hereinoccupies 5-40% of the surface area of the outer surface 134 a of thewavelength transferring cover 130 a; or in other unshown embodiments,the heat-conducting structure can be disposed both on the inner surfaceand the outer surface of the wavelength transferring cover.

The heat-conducting structure 140 d of the light-emitting device 100 dcan be also, as shown by FIG. 5, for example, a mesh heat-conductingstructure, which has a second inner surface 142 d and a second outersurface 144 d opposite to each other. The wavelength transferring cover130 b has a first inner surface 132 b and a first outer surface 134 bopposite to each other. In particular, the second inner surface 142 dand the second outer surface 144 d of the heat-conducting structure 140d are substantially coplanar respectively with the first inner surface132 b and the first outer surface 134 of the wavelength transferringcover 130 b, i.e., the heat-conducting structure 140 d and thewavelength transferring cover 130 b are embedded with each other. Inthis way, in addition to directly deliver the heat produced by thelight-emitting element 120 to outside, the heat can also quicklyexpelled by the heat-conducting structure 140 d via the base 110 toavoid the heat from concentrating or staying on the wavelengthtransferring cover 130 b.

The invention certainly does not limit the structure design of theheat-conducting structures 140 a, 140 b, 140 c and 140 d, although theheat-conducting structures 140 a, 140 b, 140 c and 140 d herein areembodied with a mesh heat-conducting structure already and have a largerheat-dissipating surface area. However in other unshown embodiments, theheat-conducting structure can be also a sheet heat-conducting structure,a tube heat-conducting structure or a heat-conducting structure composedof a polygonal sheet body (for example, a pentagonal or hexagonal sheetbody), which still belongs to the technical scheme of the inventionwithout departing the protection scope of the invention.

In order to further advance the light emitting effect of thelight-emitting element 120, referring to FIG. 6, a light-emitting device100 e of the embodiment can further include a reflective material layer150 disposed on the heat-conducting structure 140 a. The material of thereflective material layer 150 is, for example, selected from at leastone of silver, chromium, nickel and aluminium, or the reflectivematerial layer 150 is a distributed Bragg reflector (DBR).

In summary, since the heat-conducting structure of the invention isdisposed on the base and directly contacts the wavelength transferringcover, the heat-conducting structure can quickly expel the heat producedby the light-emitting element and avoid the heat produced by thelight-emitting element from concentrating on the wavelength transferringcover so as to effectively reduce the thermal quenching phenomenon ofluminescence of the wavelength transferring cover. In short, thelight-emitting device of the invention has better heat-dissipatingeffect and can effectively avoid producing the thermal quenchingphenomenon of luminescence.

It will be apparent to those skilled in the art that the descriptionsabove are several preferred embodiments of the invention only, whichdoes not limit the implementing range of the invention. Variousmodifications and variations can be made to the structure of theinvention without departing from the scope or spirit of the invention.The claim scope of the invention is defined by the claims hereinafter.

What is claimed is:
 1. A light-emitting device, comprising: a base; awavelength converting structure, comprising: a heat-conducting structurecomprising a plurality of accommodating spaces; and a wavelengthconverting material filled in the accommodating spaces; and at least onelight-emitting element disposed on the base, wherein the base isconnected to the heat-conducting structure, and the wavelengthconverting structure covers the light-emitting element.
 2. Thelight-emitting device as claimed in claim 1, wherein material of theheat-conducting structure is selected from the group consisting ofsilver, gold, copper, platinum, tin, aluminium, carbon nanotube,graphene and combinations thereof.
 3. The light-emitting device asclaimed in claim 1 further comprising: a heat-dissipating base, whereinthe base is disposed on the heat-dissipating base.
 4. The light-emittingdevice as claimed in claim 3, wherein material of the heat-dissipatingbase is selected from the group consisting of aluminium, tin, copper,silver, gold, ceramic and combinations thereof.
 5. The light-emittingdevice as claimed in claim 1 further comprising: a reflective materiallayer, disposed on the heat-conducting structure.
 6. The light-emittingdevice as claimed in claim 5, wherein material of the reflectivematerial layer is selected from the group consisting of silver,chromium, nickel, aluminium and combinations thereof.
 7. Thelight-emitting device as claimed in claim 5, wherein the reflectivematerial layer is a distributed Bragg reflector (DBR).
 8. Thelight-emitting device as claimed in claim 1, wherein the wavelengthconverting material occupies 60%-95% of the surface of the wavelengthconverting structure.
 9. A light-emitting device, comprising: a basehaving at least one light-emitting element mounted thereon; aheat-conducting meshed frame connected to the base; and a plurality ofwavelength converting blocks embedded in meshes of the heat-conductingmeshed frame, the wavelength converting blocks and the heat-conductingmeshed frame covering the light-emitting element.
 10. The light-emittingdevice as claimed in claim 9, wherein material of the heat-conductingmeshed frame is selected from the group consisting of silver, gold,copper, platinum, tin, aluminium, carbon nanotube, graphene andcombinations thereof.
 11. The light-emitting device as claimed in claim9 further comprising: a heat-dissipating base, wherein the base isdisposed on the heat-dissipating base.
 12. The light-emitting device asclaimed in claim 11, wherein material of the heat-dissipating base isselected from the group consisting of aluminium, tin, copper, silver,gold, ceramic and combinations thereof.
 13. The light-emitting device asclaimed in claim 9 further comprising: a reflective material layer,disposed on the heat-conducting meshed frame.
 14. The light-emittingdevice as claimed in claim 13, wherein material of the reflectivematerial layer is selected from the group consisting of silver,chromium, nickel, aluminium and combinations thereof.
 15. Thelight-emitting device as claimed in claim 13, wherein the reflectivematerial layer is a DBR.
 16. A light-emitting device, comprising: a basehaving at least one light-emitting element mounted thereon; a wavelengthconverting layer; and a light-transmissive and heat-conducting bodyconnected to the base, wherein the wavelength converting layer iscarried and covered by the heat-conducting body, and the wavelengthconverting layer and the heat-conducting body cover the light-emittingelement.
 17. The light-emitting device as claimed in claim 16, whereinmaterial of the heat-conducting body is selected from the groupconsisting of silver, gold, copper, platinum, tin, aluminium, carbonnanotube, graphene and combinations thereof.
 18. The light-emittingdevice as claimed in claim 16 further comprising: a heat-dissipatingbase, wherein the base is disposed on the heat-dissipating base.
 19. Thelight-emitting device as claimed in claim 18, wherein material of theheat-dissipating base is selected from the group consisting ofaluminium, tin, copper, silver, gold, ceramic and combinations thereof.20. The light-emitting device as claimed in claim 16 further comprising:a reflective material layer, disposed on the heat-conducting body. 21.The light-emitting device as claimed in claim 20, wherein material ofthe reflective material layer is selected from the group consisting ofsilver, chromium, nickel, aluminium and combinations thereof.
 22. Thelight-emitting device as claimed in claim 20, wherein the reflectivematerial layer is a distributed Bragg reflector (DBR).
 23. Alight-emitting device, comprising: a light emitting base; a wavelengthconverting material covering the light emitting base; and a reflectiveand heat-conducting body connecting the light emitting base and thewavelength converting material, and the reflective and heat-conductingbody being light-transmissive.
 24. The light-emitting device as claimedin claim 23, wherein the light emitting base comprises: a base; and atleast one light-emitting element disposed on the base, wherein the baseis connected to the carrier, and the wavelength converting material andthe carrier cover the light-emitting element.
 25. The light-emittingdevice as claimed in claim 23, wherein material of the carrier isselected from the group consisting of silver, gold, copper, platinum,aluminium, carbon nanotube, graphene and combinations thereof.
 26. Thelight-emitting device as claimed in claim 23 further comprising: aheat-dissipating base, wherein the light emitting base is disposed onthe heat-dissipating base.
 27. The light-emitting device as claimed inclaim 26, wherein material of the heat-dissipating base is selected fromthe group consisting of aluminium, tin, copper, silver, gold, ceramicand combinations thereof.
 28. The light-emitting device as claimed inclaim 23 further comprising: a reflective material layer, disposed onthe carrier.
 29. The light-emitting device as claimed in claim 28,wherein material of the reflective material layer is selected from thegroup consisting of silver, chromium, nickel, aluminium and combinationsthereof.
 30. The light-emitting device as claimed in claim 28, whereinthe reflective material layer is a DBR.
 31. The light-emitting device asclaimed in claim 23, wherein the carrier occupies 5-40% of the surfacearea of the wavelength converting cover.